Sony H3 H5 H7 H9 Wireless Headset Head Pad Widened Headband Pressure-relief

The headset features a widened headband with a pressure-relieving pad; it offers adjustable tension, supports dual-sided installation, avoids putting pressure on the head, and enhances wearing comfort.

The headband utilizes 3D-printed TPU material: Thermoplastic Polyurethane (TPU) is a class of elastomers that can be plasticized by heat and dissolved by solvents. It boasts excellent comprehensive properties—including high strength and toughness, as well as resistance to water, mold, and oil—and offers good processability, making it widely used in sectors such as national defense, healthcare, and the food industry. High mechanical strength: TPU products exhibit outstanding load-bearing capacity, impact resistance, and shock-absorbing performance. Excellent low-temperature resistance: TPU has a relatively low glass transition temperature, maintaining good elasticity, flexibility, and other physical properties even at temperatures as low as -35°C. Good processability: TPU can be processed using standard thermoplastic manufacturing methods, such as 3D printing, injection molding, extrusion, and calendering.

Installation Instructions

Spread the headband open, mount it onto the headphone frame, and insert the bolt to secure it in place.